INTERNATIONAL PATENT: SHANGHAI XIANFANG SEMICONDUCTOR CO., LTD., 上海先方半导体有限公司, NATIONAL CENTER FOR ADVANCED PACKAGING CO., LTD., 华进半导体封装先导技术研发中心有限公司 FILES APPLICATION FOR "DDR MODULE PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREFOR"

Posted On: 2026-03-08

GENEVA, March 8 -- SHANGHAI XIANFANG SEMICONDUCTOR CO., LTD. (Room 301-7, Building 6, No. 690 Bibo Road, China (Shanghai) Pilot Free Trade Zone,Pudong New Area, Shanghai 200120), 上海先方半导体有限公司 (中国上海市浦东新区中国（上海）自由贸易试验区碧波路690号6幢301-7室), NATIONAL CENTER FOR ADVANCED PACKAGING CO., LTD. (Building D1, China Sensor Network International Innovation Park, 200 Linghu Boulevard, Taihu International Tech-Park, Xinwu DistrictWuxi, Jiangsu 214135), 华进半导体...

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INTERNATIONAL PATENT: SHANGHAI XIANFANG SEMICONDUCTOR CO., LTD., 上海先方半导体有限公司, NATIONAL CENTER FOR ADVANCED PACKAGING CO., LTD., 华进半导体封装先导技术研发中心有限公司 FILES APPLICATION FOR "DDR MODULE PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREFOR"