INTERNATIONAL PATENT: SHANGHAI TECHSENSE CO., LTD, 上海世禹精密设备股份有限公司 FILES APPLICATION FOR "AUXILIARY SYSTEM FOR ELECTRONIC PACKAGING DEVICE"

GENEVA, March 29 -- SHANGHAI TECHSENSE CO., LTD (Building 1, No.76 Jinma Road, JiutingSongjiang District, Shanghai 201615), 上海世禹精密设备股份有限公司 (中国上海市松江区九亭镇金马路76号1幢) filed a patent application (PCT/CN2024/121615) for "AUXILIARY SYSTEM FOR ELECTRONIC PACKAGING DEVICE" on Sep 27, 2024. With publication no. WO/2026/060737, the details related to the patent application was published on Mar 26, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellect...