INTERNATIONAL PATENT: SHANGHAI MEADVILLE ELECTRONICS CO., LTD., 上海美维电子有限公司 FILES APPLICATION FOR "FABRICATING METHOD FOR STEPPED COPPER CIRCUIT BOARD HAVING THROUGH HOLES AND BLIND VIAS IN THIN COPPER AREA"

GENEVA, May 9 -- SHANGHAI MEADVILLE ELECTRONICS CO., LTD. (No.200, East Jiangtian Road, Songjiang Industrial ZoneSongjiang District, Shanghai 201613), 上海美维电子有限公司 (中国上海市松江区松江工业区江田东路200号) filed a patent application (PCT/CN2025/082630) for "FABRICATING METHOD FOR STEPPED COPPER CIRCUIT BOARD HAVING THROUGH HOLES AND BLIND VIAS IN THIN COPPER AREA" on Mar 14, 2025. With publication no. WO/2026/091376, the details related to the patent application was published on May 07, 2026.

Notably, the patent application was submitted under the International Paten...