INTERNATIONAL PATENT: SHANGHAI FINE CHIP SEMICONDUCTOR CO., LTD., 上海朕芯微电子科技有限公司 FILES APPLICATION FOR "WAFER BACKSIDE ALIGNMENT MARK AND MANUFACTURING METHOD THEREFOR"

GENEVA, April 27 -- SHANGHAI FINE CHIP SEMICONDUCTOR CO., LTD. (No. 455 Xiaonan Road,Fengxian District, Shanghai 201401), 上海朕芯微电子科技有限公司 (中国上海市奉贤区肖南路455号) filed a patent application (PCT/CN2025/095032) for "WAFER BACKSIDE ALIGNMENT MARK AND MANUFACTURING METHOD THEREFOR" on May 15, 2025. With publication no. WO/2026/081474, the details related to the patent application was published on Apr 23, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (...