INTERNATIONAL PATENT: SHANGHAI CULTIVA MEDICAL DEVICE CO., LTD., 上海修能医疗器械有限公司 FILES APPLICATION FOR "RADIO-FREQUENCY CUTTING BIOPSY NEEDLE AND METHOD FOR USING SAME"

GENEVA, Dec. 28 -- SHANGHAI CULTIVA MEDICAL DEVICE CO., LTD. (Room 202, Building No1, 269 Lianchuang RoadPudong New Area, Shanghai 201210), 上海修能医疗器械有限公司 (中国上海市浦东新区联创路269号1幢202室) filed a patent application (PCT/CN2025/080329) for "RADIO-FREQUENCY CUTTING BIOPSY NEEDLE AND METHOD FOR USING SAME" on Mar 03, 2025. With publication no. WO/2025/260831, the details related to the patent application was published on Dec 26, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the Worl...