INTERNATIONAL PATENT: SHANGHAI BANGXIN SEMI TECHNOLOGY CO., LTD., 上海邦芯半导体科技有限公司 FILES APPLICATION FOR "PLASMA ETCHING DEVICE AND PLASMA ETCHING METHOD"
GENEVA, May 9 -- SHANGHAI BANGXIN SEMI TECHNOLOGY CO., LTD. (No.7 Plant, No.9 Plant, No.358 Pingxiao Road, China (Shanghai) Pilot Free Trade Zone Lin-Gang New AreaPudong New Area, Shanghai 201304), 上海邦芯半导体科技有限公司 (中国上海市浦东新区中国(上海)自由贸易试验区临港新片区平霄路358号7号厂房、9号厂房) filed a patent application (PCT/CN2025/113057) for "PLASMA ETCHING DEVICE AND PLASMA ETCHING METHOD" on Aug 06, 2025. With publication ...
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