INTERNATIONAL PATENT: SHANGHAI ALLIED INDUSTRIAL CO., LTD., 上海阿莱德实业股份有限公司 FILES APPLICATION FOR "HIGH-STRENGTH SUBSTRATE-FREE THERMALLY CONDUCTIVE INSULATING SHEET AND PREPARATION METHOD THEREFOR"

GENEVA, May 9 -- SHANGHAI ALLIED INDUSTRIAL CO., LTD. (Building 6, No.1368 Fengpao RoadFengxian District, Shanghai 201400), 上海阿莱德实业股份有限公司 (中国上海市奉贤区奉炮公路1368号6栋) filed a patent application (PCT/CN2024/139049) for "HIGH-STRENGTH SUBSTRATE-FREE THERMALLY CONDUCTIVE INSULATING SHEET AND PREPARATION METHOD THEREFOR" on Dec 13, 2024. With publication no. WO/2026/091250, the details related to the patent application was published on May 07, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is ma...