GENEVA, July 27 -- APPLIED MATERIALS, INC. filed a patent application (CN2025/073060) for “SEQUENCE TO ELIMINATE RING SIGNATURE ON SUBSTRATE”. With publication no. WO/2026/152379, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: B24B 37/00
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Disclaimer: Curated by HT Syndication....