GENEVA, July 2 -- TDK SENSEI PTE. LTD filed a patent application (JP2024/045241) for “SENSOR MODULE AND INFORMATION PROCESSING DEVICE”. With publication no. WO/2026/133549, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: G01H 17/00
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Disclaimer: Curated by HT Syndication....