International Patent: SEMICONDUCTOR STRUCTURE AND PREPARATION METHOD THEREFOR, AND PROCESSOR AND ELECTRONIC DEVICE

GENEVA, July 6 -- HUAWEI TECHNOLOGIES CO., LTD. filed a patent application (CN2025/109076) for “SEMICONDUCTOR STRUCTURE AND PREPARATION METHOD THEREFOR, AND PROCESSOR AND ELECTRONIC DEVICE”. With publication no. WO/2026/137811, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H10B 10/00

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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