International Patent: SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE

GENEVA, June 19 -- SONY SEMICONDUCTOR SOLUTIONS CORPORATION filed a patent application (JP2025/032879) for “SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE”. With publication no. WO/2026/105448, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H10F 39/12

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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