International Patent: SEMICONDUCTOR DEVICES SUPPORTING HIGH MEMORY DENSITY, AND ASSOCIATED SYSTEMS AND METHODS

GENEVA, Sept. 18 -- MICRON TECHNOLOGY, INC. filed a patent application (US2026/015895) for “SEMICONDUCTOR DEVICES SUPPORTING HIGH MEMORY DENSITY, AND ASSOCIATED SYSTEMS AND METHODS”. With publication no. WO/2026/187513, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H10W 90/00

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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