GENEVA, July 2 -- MICROCHIP TECHNOLOGY INCORPORATED filed a patent application (US2025/032633) for “SEMICONDUCTOR DEVICE WITH CARRIER HEAT SINK”. With publication no. WO/2026/135730, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: G02B 6/42
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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