International Patent: SEMICONDUCTOR DEVICE ASSEMBLIES WITH BOND LINES INCLUDING ALUMINUM NITRIDE GAP FILL MATERIAL AND METHODS OF FORMING THE SAME

GENEVA, July 2 -- MICRON TECHNOLOGY, INC. filed a patent application (US2025/059509) for “SEMICONDUCTOR DEVICE ASSEMBLIES WITH BOND LINES INCLUDING ALUMINUM NITRIDE GAP FILL MATERIAL AND METHODS OF FORMING THE SAME”. With publication no. WO/2026/136177, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H10W 20/41

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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