International Patent: SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR, INTEGRATED CIRCUIT, AND ELECTRONIC DEVICE

GENEVA, July 9 -- HUAWEI TECHNOLOGIES CO., LTD. filed a patent application (CN2025/104865) for “SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR, INTEGRATED CIRCUIT, AND ELECTRONIC DEVICE”. With publication no. WO/2026/066376, here are the other details related to the patent application:

Kind: Corrected version of pamphlet [A9]

IPC: H10D 12/00

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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