International Patent: SEMICONDUCTOR DEVICE, PACKAGE, AND PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE

GENEVA, Aug. 21 -- MITSUBISHI ELECTRIC CORPORATION filed a patent application (JP2025/005220) for “SEMICONDUCTOR DEVICE, PACKAGE, AND PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE”. With publication no. WO/2026/172531, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H01L 23/28

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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