International Patent: SEMICONDUCTOR CHIPLET, PACKAGE COMPONENT FABRICATION METHOD AND SEMICONDUCTOR CHIPLET FABRICATION METHOD

GENEVA, June 26 -- RAPIDUS CORPORATION filed a patent application (JP2024/043310) for “SEMICONDUCTOR CHIPLET, PACKAGE COMPONENT FABRICATION METHOD AND SEMICONDUCTOR CHIPLET FABRICATION METHOD”. With publication no. WO/2026/120817, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H01L 21/60

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Disclaimer: Curated by HT Syndication....