International Patent: SELECTIVE ETCHING OF DIELECTRIC MATERIALS ON CARBON-BASED LOW DIMENSIONAL MATERIALS

GENEVA, July 6 -- IDEADED, S.L. filed a patent application (EP2025/088946) for “SELECTIVE ETCHING OF DIELECTRIC MATERIALS ON CARBON-BASED LOW DIMENSIONAL MATERIALS”. With publication no. WO/2026/139585, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H10P 50/28

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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