International Patent: SELECTIVE CHEMICAL ATOMIC LAYER ETCHING FOR METAL CONTAINING COMPOUNDS

GENEVA, July 1 -- TOKYO ELECTRON LIMITED filed a patent application (US2025/047753) for “SELECTIVE CHEMICAL ATOMIC LAYER ETCHING FOR METAL CONTAINING COMPOUNDS”. With publication no. WO/2026/128049, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H10P 50/26

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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