International Patent: SEAM-FREE GAPFILL OF DIELECTRIC FILMS

GENEVA, July 2 -- LAM RESEARCH CORPORATION filed a patent application (US2025/060434) for “SEAM-FREE GAPFILL OF DIELECTRIC FILMS”. With publication no. WO/2026/136739, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H10P 14/60

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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