GENEVA, Oct. 5 -- RESONAC CORPORATION filed a patent application (JP2026/009642) for “SEALING RESIN COMPOSITION, ELECTRONIC COMPONENT DEVICE, AND METHOD FOR PRODUCING ELECTRONIC COMPONENT DEVICE”. With publication no. WO/2026/204423, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H10W 74/47
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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