INTERNATIONAL PATENT: SANDISK TECHNOLOGIES, INC. FILES APPLICATION FOR "THREE-DIMENSIONAL MEMORY DEVICE WITH SIDE-CONTACT THROUGH-STACK CONTACT VIA STRUCTURES AND METHODS FOR FORMING THE SAME"

GENEVA, March 18 -- SANDISK TECHNOLOGIES, INC. (951 Sandisk DriveMilpitas, California 95035) filed a patent application (PCT/US2025/025614) for "THREE-DIMENSIONAL MEMORY DEVICE WITH SIDE-CONTACT THROUGH-STACK CONTACT VIA STRUCTURES AND METHODS FOR FORMING THE SAME" on Apr 21, 2025. With publication no. WO/2026/054825, the details related to the patent application was published on Mar 12, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): OIWA, Mako (951 Sandisk DriveMilpitas, California 95035), TAKAHASHI, Akira (951 Sandisk DriveMilpitas, California 95035), KOBAYASHI, Masaru (951 Sandisk DriveM...