GENEVA, April 19 -- SAMSUNG ELECTRONICS CO., LTD. (129, Samsung-ro,Yeongtong-gu, Suwon-si,Gyeonggi-do 16677) filed a patent application (PCT/KR2025/015853) for "METHOD AND APPARATUS FOR SUPPORTING MULTI-HOP SIDELINK RELAY" on Oct 02, 2025. With publication no. WO/2026/079892, the details related to the patent application was published on Apr 16, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): TESANOVIC, Milos (Samsung Electronics (UK) Limited, Samsung R&D Institute UK, Samsung House, Hillswood Drive, Chertsey,Chertsey, Surrey KT16 0RS)
Abstract: A method of a UE in a relay network is provid...