International Patent: ROUNDNESS-OPTIMIZED THROUGH-HOLES IN A WORKPIECE

GENEVA, Sept. 24 -- TRUMPF LASER- UND SYSTEMTECHNIK SE filed a patent application (EP2026/056073) for “ROUNDNESS-OPTIMIZED THROUGH-HOLES IN A WORKPIECE”. With publication no. WO/2026/195361, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: B23K 26/0622

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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