GENEVA, June 24 -- SUDHIR SRIVASTAVA INNOVATIONS PRIVATE LIMITED filed a patent application (IN2025/051810) for “ROBOTIC ARM ASSEMBLY WITH MULTI-DIAMETER PULLEY ARRANGEMENT”. With publication no. WO/2026/115563, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: A61B 34/30
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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