International Patent: RF SIGNAL AMPLIFICATION CIRCUIT AND ELECTRONIC DEVICE INCLUDING SAME

GENEVA, Sept. 18 -- SAMSUNG ELECTRONICS CO., LTD. filed a patent application (KR2026/003555) for “RF SIGNAL AMPLIFICATION CIRCUIT AND ELECTRONIC DEVICE INCLUDING SAME”. With publication no. WO/2026/187171, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H03F 3/189

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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