INTERNATIONAL PATENT: RESONAC CORPORATION, SHANGHAI JIAO TONG UNIVERSITY FILES APPLICATION FOR "POLYMER, CURABLE RESIN COMPOSITION, CURED PRODUCT, BONDING ADHESIVE SHEET AND SEMICONDUCTOR DEVICE"

GENEVA, May 9 -- RESONAC CORPORATION (9-1, Higashi-Shimbashi 1-chome, Minato-kuTokyo 105-7325), SHANGHAI JIAO TONG UNIVERSITY (800 Dongchuan Rd.Minhang District, Shanghai 200240) filed a patent application (PCT/CN2024/127577) for "POLYMER, CURABLE RESIN COMPOSITION, CURED PRODUCT, BONDING ADHESIVE SHEET, AND SEMICONDUCTOR DEVICE" on Oct 28, 2024. With publication no. WO/2026/090766, the details related to the patent application was published on May 07, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): MATSUTANI, Hiroshi (Resonac Corporation, 9-1, Higashi-Shimbashi 1-chome, Minato-kuTokyo 105-7...