GENEVA, April 19 -- RESONAC CORPORATION (9-1, Higashi-Shimbashi 1-chome, Minato-ku, Tokyo1057325), 株式会社レゾナック (東京都港区東新橋一丁目9番1号) filed a patent application (PCT/JP2025/033401) for "REACTIVE HOT MELT ADHESIVE, METHOD FOR PRODUCING REACTIVE HOT MELT ADHESIVE, STRUCTURAL BODY, CLOTHING ITEM, AND METHOD FOR PRODUCING STRUCTURAL BODY" on Sep 22, 2025. With publication no. WO/2026/079117, the details related to the patent application was published on Apr 16, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is manag...