INTERNATIONAL PATENT: RESONAC CORPORATION, 株式会社レゾナック FILES APPLICATION FOR "POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, INSULATING RESIN FILM, METHOD OF FORMING INSULATING RESIN FILM, SEMICONDUCTOR DEVICE, IMIDE COMPOUND AND ALKALI-SOLUBLE RESIN"

GENEVA, March 10 -- RESONAC CORPORATION (9-1, Higashi-Shimbashi 1-chome, Minato-ku, Tokyo1057325), 株式会社レゾナック (東京都港区東新橋一丁目９番１号) filed a patent application (PCT/JP2024/031073) for "POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, INSULATING RESIN FILM, METHOD OF FORMING INSULATING RESIN FILM, SEMICONDUCTOR DEVICE, IMIDE COMPOUND, AND ALKALI-SOLUBLE RESIN" on Aug 29, 2024. With publication no. WO/2026/047961, the details related to the patent application was published on Mar 05, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) sy...