GENEVA, April 28 -- RESONAC CORPORATION (9-1, Higashi-Shimbashi 1-chome, Minato-ku, Tokyo1057325), 株式会社レゾナック (東京都港区東新橋一丁目９番１号) filed a patent application (PCT/JP2025/036070) for "POLISHING METHOD, SLURRY, AND ABRASIVE GRAINS" on Oct 10, 2025. With publication no. WO/2026/083934, the details related to the patent application was published on Apr 23, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): HAGIWARA Mai (c/o Resonac Corpo...