INTERNATIONAL PATENT: RESONAC CORPORATION, 株式会社レゾナック FILES APPLICATION FOR "METHOD FOR SELECTING SUBSTRATE FILM, DICING DIE-ATTACH INTEGRATED FILM AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE"

GENEVA, April 7 -- RESONAC CORPORATION (9-1, Higashi-Shimbashi 1-chome, Minato-ku, Tokyo1057325), 株式会社レゾナック (東京都港区東新橋一丁目９番１号) filed a patent application (PCT/JP2025/032227) for "METHOD FOR SELECTING SUBSTRATE FILM, DICING DIE-ATTACH INTEGRATED FILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE" on Sep 11, 2025. With publication no. WO/2026/070422, the details related to the patent application was published on Apr 02, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual ...