INTERNATIONAL PATENT: RESONAC CORPORATION, 株式会社レゾナック FILES APPLICATION FOR "FILM-LIKE ADHESIVE, INTEGRATED DICING/DIE BONDING FILM AND SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SAME"

GENEVA, March 24 -- RESONAC CORPORATION (9-1, Higashi-Shimbashi 1-chome, Minato-ku, Tokyo1057325), 株式会社レゾナック (東京都港区東新橋一丁目９番１号) filed a patent application (PCT/JP2025/032210) for "FILM-LIKE ADHESIVE, INTEGRATED DICING/DIE BONDING FILM, AND SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SAME" on Sep 11, 2025. With publication no. WO/2026/058939, the details related to the patent application was published on Mar 19, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property O...