INTERNATIONAL PATENT: RESONAC CORPORATION, 株式会社レゾナック FILES APPLICATION FOR "CURABLE RESIN COMPOSITION FOR HYBRID BONDING AND METHOD FOR PRODUCING CIRCUIT CONNECTION BODY"

GENEVA, Feb. 17 -- RESONAC CORPORATION (9-1, Higashi-Shimbashi 1-chome, Minato-ku, Tokyo1057325), 株式会社レゾナック (東京都港区東新橋一丁目９番１号) filed a patent application (PCT/JP2024/028526) for "CURABLE RESIN COMPOSITION FOR HYBRID BONDING, AND METHOD FOR PRODUCING CIRCUIT CONNECTION BODY" on Aug 08, 2024. With publication no. WO/2026/033761, the details related to the patent application was published on Feb 12, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO...