INTERNATIONAL PATENT: RESONAC CORPORATION, 株式会社レゾナック FILES APPLICATION FOR "ABRASIVE GRAIN, SLURRY, POLISHING METHOD, COMPONENT FABRICATION METHOD AND SEMICONDUCTOR COMPONENT FABRICATION METHOD"

GENEVA, April 19 -- RESONAC CORPORATION (9-1, Higashi-Shimbashi 1-chome, Minato-ku, Tokyo1057325), 株式会社レゾナック (東京都港区東新橋一丁目９番１号) filed a patent application (PCT/JP2025/035483) for "ABRASIVE GRAIN, SLURRY, POLISHING METHOD, COMPONENT FABRICATION METHOD, AND SEMICONDUCTOR COMPONENT FABRICATION METHOD" on Oct 06, 2025. With publication no. WO/2026/079355, the details related to the patent application was published on Apr 16, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Pr...