International Patent: RESIST COMPOSITION, RESIST PATTERN FORMATION METHOD, COMPOUND, CHAIN-TRANSFER AGENT, AND POLYMER

GENEVA, July 31 -- TOKYO OHKA KOGYO CO., LTD. filed a patent application (JP2026/001816) for “RESIST COMPOSITION, RESIST PATTERN FORMATION METHOD, COMPOUND, CHAIN-TRANSFER AGENT, AND POLYMER”. With publication no. WO/2026/160374, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: G03F 7/039

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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