GENEVA, July 1 -- TOKYO OHKA KOGYO CO., LTD. filed a patent application (JP2025/043102) for “RESIST COMPOSITION, METHOD FOR FORMING RESIST PATTERN, COMPOUND, AND ACID DIFFUSION CONTROLLING AGENT”. With publication no. WO/2026/127063, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: G03F 7/004
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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