GENEVA, Aug. 14 -- ASAHI KASEI KABUSHIKI KAISHA filed a patent application (JP2025/045541) for “RESIN SUBSTRATE, METAL-CLAD LAMINATE, AND WIRING BOARD”. With publication no. WO/2026/168054, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H05K 1/03
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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