GENEVA, June 19 -- TOWA CORPORATION filed a patent application (JP2025/026503) for “RESIN MOLDING DEVICE AND RESIN MOLDED ARTICLE MANUFACTURING METHOD”. With publication no. WO/2026/105389, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: B29C 43/32
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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