GENEVA, July 27 -- ASAHI KASEI KABUSHIKI KAISHA filed a patent application (JP2025/045449) for “RESIN COMPOSITION AND MOLDED BODY”. With publication no. WO/2026/154960, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: C08L 71/10
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Disclaimer: Curated by HT Syndication....