GENEVA, Oct. 22 -- RESONAC CORPORATION filed a patent application (JP2026/015162) for “RESIN COMPOSITION, PREPREG, LAMINATED PLATE, RESIN FILM, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE”. With publication no. WO/2026/221036, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: C08L 79/00
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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