GENEVA, June 24 -- FUJIFILM CORPORATION filed a patent application (JP2025/040492) for “RESIN COMPOSITION, CURED PRODUCT, METHOD FOR PRODUCING CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING LAMINATE, SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE”. With publication no. WO/2026/116203, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: C08L 79/08
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Disclaimer: Curated by HT Syndication....