GENEVA, Aug. 21 -- FUJIFILM CORPORATION filed a patent application (JP2026/004711) for “RESIN COMPOSITION, CURED PRODUCT, LAYERED BODY, MANUFACTURING METHOD FOR CURED PRODUCT, MANUFACTURING METHOD FOR LAYERED BODY, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, POLYIMIDE, AND SYNTHESIS METHOD FOR POLYIMIDE”. With publication no. WO/2026/172946, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: C08G 73/12
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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