GENEVA, Aug. 21 -- FUJIFILM CORPORATION filed a patent application (JP2026/004722) for “RESIN COMPOSITION, CURED PRODUCT, LAMINATE, METHOD FOR MANUFACTURING CURED PRODUCT, METHOD FOR MANUFACTURING LAMINATE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE”. With publication no. WO/2026/172949, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: C08L 79/08
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Disclaimer: Curated by HT Syndication....