GENEVA, Aug. 14 -- NIPPON CHEMICAL INDUSTRIAL CO., LTD. filed a patent application (JP2026/003253) for “RESIN COMPOSITION, CONDUCTIVE ADHESIVE, ADHESIVE STRUCTURE, AND ELECTRONIC COMPONENT”. With publication no. WO/2026/168303, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: C08L 63/00
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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