International Patent: RESIN COMPOSITION, ADHESIVE AGENT, SEALING MATERIAL, CURED PRODUCT, SEMICONDUCTOR DEVICE, AND ELECTRONIC COMPONENT

GENEVA, Aug. 21 -- NAMICS CORPORATION filed a patent application (JP2026/001568) for “RESIN COMPOSITION, ADHESIVE AGENT, SEALING MATERIAL, CURED PRODUCT, SEMICONDUCTOR DEVICE, AND ELECTRONIC COMPONENT”. With publication no. WO/2026/172737, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: C08G 59/24

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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