International Patent: REPLACEABLE ELECTRONIC COMPONENT WITH DURABLE HEAT DISSIPATION

GENEVA, Aug. 31 -- HENKEL AG & CO. KGAA filed a patent application (US2026/015622) for “REPLACEABLE ELECTRONIC COMPONENT WITH DURABLE HEAT DISSIPATION”. With publication no. WO/2026/178087, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H05K 7/20

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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