GENEVA, June 19 -- APPLIED MATERIALS, INC. filed a patent application (US2025/048353) for “REPAIRING LOW-K MATERIALS WITH SILICON-FREE TREATMENT PRECURSORS TO PREVENT SILICON RESIDUE FORMATION”. With publication no. WO/2026/106723, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H10P 14/60

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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