INTERNATIONAL PATENT: RENESAS ELECTRONICS AMERICA INC., CHEN, BIAO FILES APPLICATION FOR "FLOATING STRUCTURE AT PACKAGE BALL GRID ARRAY FOR CROSSTALK CANCELLATION"

GENEVA, March 20 -- RENESAS ELECTRONICS AMERICA INC. (1001 Murphy Ranch Road, MilpitasCalifornia 95035), CHEN, Biao (c/o Renesas Integrated Circuit (Shanghai) Co., Ltd. Suite 1202 12th Floor, Tower 1 65 Guiqing RoadXuhui District, Shanghai 200233) filed a patent application (PCT/CN2024/118284) for "FLOATING STRUCTURE AT PACKAGE BALL GRID ARRAY FOR CROSSTALK CANCELLATION" on Sep 11, 2024. With publication no. WO/2026/055848, the details related to the patent application was published on Mar 19, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): CHEN, Biao (c/o Renesas Integrated Circuit (Shangha...