International Patent: RECONFIGURABLE INTERCONNECTION CIRCUIT FOR MULTI-CORE PROCESSOR, IMPLEMENTATION METHOD, AND CHIP

GENEVA, June 24 -- BEIJING SMARTCHIP MICROELECTRONICS TECHNOLOGY COMPANY LIMITED filed a patent application (CN2024/134508) for “RECONFIGURABLE INTERCONNECTION CIRCUIT FOR MULTI-CORE PROCESSOR, IMPLEMENTATION METHOD, AND CHIP”. With publication no. WO/2026/112775, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: G06F 15/17

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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