INTERNATIONAL PATENT: RAYMOND, LAM WAI KIN, 林伟健 FILES APPLICATION FOR "PACKAGING SUBSTRATE AND POWER MODULE"

GENEVA, March 22 -- RAYMOND, Lam Wai Kin (Room B12 10/F., No.52 Hung To Road, Kwun TongHong Kong 999077), 林伟健 (中国香港特别行政区观塘鸿图道52号10楼B12室) filed a patent application (PCT/CN2024/142160) for "PACKAGING SUBSTRATE AND POWER MODULE" on Dec 25, 2024. With publication no. WO/2026/056171, the details related to the patent application was published on Mar 19, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): RAYMOND, Lam Wai Kin (Room B12 10/F., No.52 Hung To Road, ...